G04600 - SEMI G46 - Test Method for Thermal Transient Testing for Die Attachment Evaluation of Integrated Circuits Revision:Default Title orgで入手可能になり，2003年7月発行に至る。初版は1996年12月発行。

orgで入手可能になり，2003年7月発行に至る。初版は1996年12月発行。

SEMI S19-1102 (first published)

" It is a design guideline for packaging engineers

as seen through communications with the factory

G04600 - SEMI G46 - Test Method for Thermal Transient Testing for Die Attachment Evaluation of Integrated Circuits Revision:Default Title orgで入手可能になり，2003年7月発行に至る。初版は1996年12月発行。Evaluation of semiconductor die attachment integrity using the thermal transient techniques as implemented by the Electrical Test Method on either thermal test chips or active devices. Steady state thermal response (or thermal resistance) and thermal transient response of discrete semiconductor devices and integrated circuits are sensitive to the presence of voids in the die attachment material between the semiconductor chip and package. These voids