G09000 - SEMI G90 - Specification for 300 mm Wafer Coin-Stack Type Shipping Container Used for Test and Packaging Processes Revision:SEMI G90-0811 (Reapproved 0318) - Superseded 1 This Standard defines the

1  This Standard defines the destructive pull strength test method and its criterion for evaluating pull strength of wire bonds connecting two points

6-81 (first published)

Because the zero point on the z-axis is application specific

This test procedure evaluates quantitatively the durability of flat panel display (FPD) glass substrates using reagents employed in FPD production processes

G09000 - SEMI G90 - Specification for 300 mm Wafer Coin-Stack Type Shipping Container Used for Test and Packaging Processes Revision:SEMI G90-0811 (Reapproved 0318) - Superseded 1 This Standard defines theThe purpose of this Standard is to standardize the specifications for 300 mm wafer coin stack type shipping container used for test and packaging processes for wafers. This Specification defines the dimensions of container (refer to 5. 1. 1) and requirements for securing the interface between container and processing equipment or wafer transportation equipment. This Standard specifies the requirements for wafer spacers used for separation of wafers