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SEMI E158 — Specification For Mechanical Features of Fab Wafer Carrier Used To Transport and Store 450 mm Wafers (450 FOUP) and Kinematic Coupling
Such glass may be specified with or without openings for through glass vias (TGV) or blind vias (BV)
SEMI E164-0313 (technical revision)
• type of PSL (reference material)
D05100 - SEMI D51 - Specification for Handshake Method of Single Substrate for Handling Off/On Tool in FPD Production Revision:SEMI D51-0709 - Inactive SEMI E158 — Specification ForThis standard was technically approved by the global Flat Panel Display Factory Automation Committee. This edition was approved for publication by the global Audits & Reviews Subcommittee on May 13, 2009. It was available at www. semi. org in June 2009. Originally published March 2008. Due to the migration to large substrate sizes in FPD production, the demand for single substrate transfer, with the extensive combined use of Automated Material
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